CORWIL Technology announced today that it has more than doubled its QFN production in 2015 and recently shipped its first volume MicroSD parts.
“We have seen an increase in demand in BGA and other plastic parts since the investments and improvements we have made; including our FICO molding system and MAT 6400 die attach systems,” said Matt Bergeron, President of CORWIL Technology Corporation.
Richard Tung, CORWIL’s VP of Operations, said “I am proud of the work our engineering and production teams have done to bring low volume and Quick-turn plastic packages to higher production rates. CORWIL has many open tools for QFN packages which can support 1 to 3 days NPI prototype build with short notice.”
The CORWIL sales team will be more than happy to provide additional info on Open Tool QFNs. Please visit www.corwil.com or call 408.618.8700.
About CORWIL Technology Corporation
CORWIL Technology provides high quality and responsive semiconductor assembly and test services focusing on Hi-Rel, fast-turn and wafer processing markets. Founded in 1990 and based in Milpitas, CA, CORWIL is the premier U.S. provider of full back-end assembly services and is a key partner with leading medical, Mil/Aero and commercial semiconductor companies. For more information about CORWIL, please visit www.corwil.com.