Integra Technologies Inc. - Assembly Service Guide
Learn how to make your products cost effective and designed for manufacture through the help of this detailed guide!
Our guidelines are provided to assist you in making your products more manufacturable thus achieving maximum yields.
The guidelines include:
Wafer Thinning/Individual Die Thinning
Wafer Dicing/Dice Before Grind (DBG)
Automated Visual Inspection
Flip Chip Assembly
Wire bond Assembly
Die Tape & Reel Capability
Chip-on-Board (COB) Assembly
Quad Flat No-Lead (QFN) and BGA Assembly
Laser Mark & Seam Seal
SiPho Fiber Connection