Engineering
Services
IC Fast Assembly
Integra provides a span of in-house services and capabilities to support a broad variety of Hi-Rel components throughout the entire value-added life-cycle – from prototyping, through testing, and ultimately to volume production. More specifically, Integra specializes in semiconductor die prep, packaging, assembly, test, reliability qualification, DPA and FA service for high-reliability applications. Please visit our
ESD/LU
Phasix ESD is an up-and-coming semiconductor device ESD test center. Our objective is to create a center of excellence for ESD testing allowing our customers to obtain rapid, accurate ESD test results for device qualification and characterization.
We offer Human Body Model (HBM), Machine Model (MM) and Charged Device
Model (CDM) ESD testing and we can also perform Latch-up testing. Our HBM, MM and Latch-up testers have capacity for devices up to 512 pins and our CDM tester is not limited by pincount.
We are highly responsive, offering guaranteed turnaround times to ensure your precious time-to-market is not compromised by device qualifications. Our standard guaranteed turnaround time is just five days, and we can go even faster than this if you need us to.
Our experience of more than 20 years in the ESD and semiconductor business, coupled with our accreditation to ISO9001:2008 and ISO17025:2005 assures you of the highest quality and integrity of results.
Phasix ESD is a UKAS Accredited Testing Laboratory No. 4670.
We are also proud to be members of the National Microelectronics Institute.
Reliability Tests
Since 2002, Reltech Limited has provided comprehensive semiconductor testing services, Burn-In, Reliability & Life Testing and Qualification for many well-known manufacturers and users of semiconductor devices and electronic assemblies.
The independent tests are performed to industry and customer specific standards
and are supported by highly trained and competent personnel, assuring users of the up-most integrity and confidentiality at all times.
The extensive range of test options includes:
Fully automated test systems
Industry and customer specific standards
Hardware design
Test software generation
Test socket selection & application
Device monitoring
Back End
Services
Boyd is the world’s leading innovator in sustainable engineered material and thermal solutions that make our customers’ products better, safer, faster, and more reliable. We develop and combine technologies to solve ambitious
performance targets in our customers’ most critical applications. By implementing technologies and material science in novel ways to seal, protect, cool, and interface, Boyd has continually redefined the possible and championed customer success for over 90 years.
Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave, optical and radio frequency products that connect, protect and control critical applications in the commercial aviation,
defense, space, medical, rail, semiconductor test, and industrial market segments. Smiths Interconnect is synonymous with exceptional performance whenever a technologically advanced, high-quality solution is required to ensure reliability and safety.
The MPI ThermalAir Series of temperature test systems brings precise thermal simulation test capabilities directly to your test application. In the test engineering lab or on the production test floor, the ThermalAir temperature test systems
provide flexible test solutions for an array of products and technologies.
Since 1975, M Specialties LLC has been a provider of quality consumables for the testing of Semiconductor devices. M Specialties LLC is a privately owned and operated corporation.
Within our Arizona facility we offer Engineering, Design, Manufacturing and Assembly services for semiconductor specific Test Boards. We are able to ensure that every facet of the design and manufacturing process is carried out properly, and that each product that we make will meet the standard of excellence for which M Specialties LLC has been known for.
We offer a Test Interface Unit that is designed on time, based on your requirements and within your budget. Our years of experience and dedication to customer service will ensure that you receive the test hardware that you need.
MPI Probe Card division provides a wide range of semiconductor wafer-level test solutions. IC applications include Driver, Logic, CIS, and RF, while probing on bond-pad, flip chip bump, micro-bump, and Cu
pillar. With advanced technologies to manufacture critical components, we have complete control of product consistency and precise delivery schedule management. The comprehensive designs, robust manufacturing, and state-of-the-art tooling enable us to provide unsurpassed probe cards globally.
MPI is committed to assisting our customers to maintain a competitive edge with fast, accurate responses and to deliver the highest quality test solutions.
Alcotec Precision Engineering Private Limited, a leading global precision machining parts supplier to the Semiconductor Industries.
Operating in a 28,000 square feet of
advance manufacturing facility, Alcotec is well equipped in process of latest cutting-edge technology.
Automatic Test
Equipment Service
esmo design specialists develop individual solutions for the adaptation and integration of test head manipulators and mechanical interfacing systems into test cells for both front- and back-end testing.
Based on an extensive determination and definition of requirements in cooperation with customers, esmo semicon provides a comprehensive service portfolio: from the selection of suitable equipment to completely new designs in order to create optimized and highly efficient test cells.
Our objective: to provide you with a customized system, precisely as per your requirements and demands, for increased utilization rates, an enhanced ease of use and operation as well as sustainable safety – thus, with this maximum of efficiency and profitability, a clear added value for your business.
Applications in the semiconductor industry demand high-precision, innovative state-of-the-art technology [e.g. automated optical inspection (AOI), tri-temp testing, IC testing, sensor testing etc.] as well as reliable, predictable, and sustainable performance properties within clean and controlled test floor environments for premium quality control and assurance.
As a full-service systems integrator, esmo semicon offers a full suite of test equipment solutions, including automatic test equipment (ATE) and automated handling
solutions, for the international semiconductor test industry.
We design, manufacture, and service cutting-edge technology device handling solutions, from basic sub-systems to comprehensive, turn-key automation systems, and entire platforms, as stand-alone components or as part of an integrated system
All esmo semicon products are available with standardized features for integration into most varied test floor environments, engineering, wafer sort, and final test, with all test system and mating equipment types. At request, they may be equipped with optional features for specific test cell and mating equipment demands.
esmo design specialists develop individual solutions for the adaptation and integration of test head manipulators and mechanical interfacing systems into test cells for both front- and back-end testing.
The esmo semicon test head housing has been designed to carry customized instruments and test cards. It allows you to handle your test cards like you would with a conventional ATE test head as well as to dock it to various wafer probers or device handlers.
All esmo semicon products are a result of a long-proven and time-tested joint venture:
Basing on our profound know-how, expertise, and experience of many years, we – in cooperation with our customers as well as in consideration of their feedback,
their concerns, and their requirements – develop and design customized key solutions as per your individual specifications.